Micron showed off a prototype of its 9650 Pro SSD, which uses a PCIe 6.0 x4 interface to deliver sequential reads and writes ...

Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...

Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D ...

Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...

SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...

South Korean chipmaker SK hynix said Thursday it had developed a universal flash storage chip integrating the world’s highest ...

SK Hynix Inc just launched the world’s first 96-Layer 512Gb CTF based 4D NAND Flash. This is based on their TLC arrays using 4D Charge Trap Flash (CTF) design paired with Peri Under Cell (PUC ...

But the competition sits close behind. SK Hynix is boasting a new industry benchmark with a new generation of its "4D NAND" composed of 238 layers of NAND flash-memory cells. This is an upgrade ...

The company also aims to lead the SSD market for ultra-high capacity data centers by developing 244TB products based on the world's highest 321-high 4D NAND developed in November, to overcome the ...

Instead of the usual 96 layers of TLC NAND, the P31’s TLC NAND sports 128. How this translates to “4D,” as the company refers to it in the product brief, rather than 3D, I’m not sure.

The late 1990s saw the widespread introduction of solid-state storage based around NAND Flash. Ranging from memory cards for portable devices to storage for desktops and laptops, the data storage ...