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Tom's Hardware on MSNSK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centersLeading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...
It will only be available in 512GB and 1TB capacities, which can cause problems down the line. Memory maker SK hynix has ...
Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D ...
Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...
Pain reduction with linzagolix for uterine fibroids is partly explained by reduced heavy menstrual bleeding and fibroid ...
Universal Flash Storage (UFS) memory cards appear to be on the way, promising faster memory speeds to keep up with ever faster smartphones. Samsung recently announced some details about its first ...
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So when Samsung Semiconductor announced its Universal Flash Storage 4.0 (UFS 4.0) chips in 2022, we knew it would have far-reaching benefits for the consumer electronics industry. And in early ...
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SK hynix announces the world's first 48GB 16-Hi HBM3E memory — Next-gen PCIe 6.0 SSDs and UFS 5.0 storage are also in the worksAt the SK AI Summit 2024, SK hynix CEO took the stage and revealed the industry's first 16-Hi HBM3E memory - beating both Samsung and Micron to the punch. With the development of HBM4 going strong ...
SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...
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