Micron showed off a prototype of its 9650 Pro SSD, which uses a PCIe 6.0 x4 interface to deliver sequential reads and writes ...

Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...

Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D ...

Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...

SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...

South Korean chipmaker SK hynix said Thursday it had developed a universal flash storage chip integrating the world’s highest ...

It was around 10 months ago when SK hynix announced the development of 238-layer triple-level cell (TLC) NAND flash memory, which it markets as "4D" technology, and now it has entered the mass ...

SK Hynix, the world’s second-largest memory chipmaker, is trying to pull ahead with a new generation of its "4D NAND" assembled out of 321 layers of NAND flash. Prototypes of the technology were ...

Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D NAND-based SSD for both consumers and data centers within the year.

SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's highest 321-layer 1Tb triple-level cell 4D NAND flash for mobile applications.