Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory ...

Saisuman Singamsetty specializes in privacy-preserving artificial intelligence, federated learning, and scalable digital infrastructure, establishing himself as a leading figure in intelligent data ...

Intel Corp. (NASDAQ:INTC) and Advanced Micro Devices Inc. (NASDAQ:AMD) have teamed up to form an x86 ecosystem advisory group, aiming to shape the future of one of the world’s most widely used ...

The migration to higher voltages in vehicle systems. The power and weight advantages in a 48-V system. Deploying an automotive zonal power architecture. The evolution of the automobile has been in a ...

As the evolution of space as a contested domain accelerates, defense and national security agencies must innovate—and both legacy ground systems and digital-first programs now have the chance to ...