TL;DR: Samsung Electronics plans to launch its next-generation low-power wide I/O (LPW) DRAM, also known as low-latency wide I/O (LLW), in 2028. This "mobile HBM" memory aims to enhance on-device AI ...

The global memory chip market leader Samsung and probably also SK Hynix are developing variants of low-power DDR (LPDDR) SDRAM with extremely high data transfer rates. These have many more data lines ...

As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response, Samsung ...