On-die telemetry gives architects a path to replace worst-case design margin with measured silicon behavior, improving PPA without compromising resilience. As monitor density and control-loop speed ...
An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...
Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...
Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...
Researchers from MIT, SLAC, Stanford University, and Argonne National Laboratory published a technical paper titled “Spatiotemporal mapping of anisotropic thermal transport in GaN thin films via ...
As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.
Implementing the Cyber Resilience Act: Practical Guidance for Security Engineering and Compliance is a practical eBook designed to help product manufacturers, security teams, compliance leaders, and ...
Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.
AI integration is accelerating aging in automotive sensors and other components. AI-powered systems must be built through meticulous, advanced model testing, but they also must adapt to future AI ...
Switchable analog, digital organic transistor; thread-based ICs; temporary e-tattoo electrodes.
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