The rapid use of AI is forcing engineers to totally rethink how we build chips. The modern design is no longer just about the ...

Brent Fischthal, Head of Global Marketing Communications, Koh Young Technology, Inc.

At Panasonic's Electronic Materials Division, we are at the forefront of this evolution. Our portfolio of materials includes high-reliability encapsulants for wafer-level and laminate packages, ...

NAMICS Corporation remains committed to environmental stewardship, dedicated to producing high-quality, eco-friendly ...

China's leading chipmaker, Hua Hong, witnessed a triumphant debut on the Shanghai stock market, with its IPO shares surging by 13%. This substantial jump reflects strong investor confidence in the ...

This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study.

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This toughened system features a moderately ... MasterSil 800Med is a ...

Siemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) ... Siemens Digital Industries ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

STMicroelectronics has introduced STM32MP21 microprocessors (MPUs) for cost-aware edge applications in smart factories, smart homes, and smart cities, combining advanced ... STMicroelectronics' TSZ901 ...

CoolCAD Electronics announced an expansion of its SiC product portfolio with the launch of new 3.3 kV high-power, high-temperature MOSFETs and power components engineered ... This paper presents a ...