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2d
Tom's Hardware on MSNSK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centersLeading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...
SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's ...
1d
Tom's Hardware on MSNComputex 2025 Day Four Wrap-Up: PCIe 6.0 SSD prototype, 321-layer 4D NAND, cheap 10 GbE controllers inboundMicron showed off a prototype of its 9650 Pro SSD, which uses a PCIe 6.0 x4 interface to deliver sequential reads and writes ...
SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...
Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D ...
Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...
Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D NAND-based SSD for both consumers and data centers within the year.
South Korean chipmaker SK hynix said Thursday it had developed a universal flash storage chip integrating the world’s highest ...
Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D NAND-based SSD for both consumers and data centers within the year. "We are on ...
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