Abstract: We report the advantages of using CMOS directly bonded to array (CBA) technology in 3D flash memory. Improvements in interface speed, operation latency, and memory cell reliability are ...
Abstract: The Direct Bond Interconnect (DBI ®) Ultra technology is a die-to-wafer (D2W) or die-to-die (D2D) hybrid bonding technology that offers high density Cu-Cu interconnect modules using low ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results