Broadcom Inc. today debuted two new chips, the Sian3 and Sian2M, that data center operators can use to power their optical ...

AMD holds the No. 2 spot in producing graphics processing units (GPUs) behind Nvidia. These chips have become the backbone of ...

Broadcom (AVGO) expands its 200G/lane DSP PHY portfolio with Sian3 and Sian2M, addressing the growing demands for ...

Sian3: State-of-the-art 3nm DSP PHY delivers industry’s lowest power consumption with enhanced performance for 800G and 1.6T optical transceivers ...

Broadcom announced new high-speed networking chips for AI data centers that use less power than their predecessors.

Answering a question about it at GTC 2025, Huang reportedly says: "Nobody's invited us to a consortium… Nobody invited me.

RAM Photonics Industrial has introduced the Medusa™ Array family, advancing the mass production of 2D fiber arrays designed ...

TSMC's Kaohsiung 2nm wafer fab will hold an expansion ceremony at the end of March and start accepting orders in April. Apple ...

CEO Sassine Ghazi highlighted AI’s future role in chip design, including agentic AI to augment engineering teams and accelerate innovation. Fig. 1: Synopsys’ Ghazi shows a roadmap for process scaling ...

concerns over chip restrictions, and rising competition in the AI (artificial intelligence) space. Nonetheless, Wall Street is bullish on AVGO stock due to AI tailwinds. Specifically, Broadcom’s ...

OFC, the premier global event for optical networking and communications, returns to California to celebrate a historic half-century milestone—50 years of innovation, groundbreaking research, ...