Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...
Abstract: To support the increasing demand for smart manufacturing in wire arc additive manufacturing, such as digital twins, high-frequency real-time bead measurement is a long-standing challenge due ...
Researchers demonstrated a 3D printing process that deposits tungsten carbide only where needed while preserving extreme ...
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