Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...
Abstract: To support the increasing demand for smart manufacturing in wire arc additive manufacturing, such as digital twins, high-frequency real-time bead measurement is a long-standing challenge due ...
Researchers demonstrated a 3D printing process that deposits tungsten carbide only where needed while preserving extreme ...
SHIJIAZHUANG, HEBEI, CHINA, January 20, 2026 /EINPresswire.com/ -- The global automotive supply chain is navigating a ...
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Top Laser Marking Machine Manufacturer Drives Customization and Precision in Modern Manufacturing
SHENZHEN, GUANGDONG, CHINA, January 16, 2026 /EINPresswire.com/ -- As global manufacturing embraces Industry 4.0, the ...
Abstract: This study presents a novel approach to spectral beam combining for achieving high output powers with a compact, single module seed laser source based on frequency combs. By utilizing an ...
Oak Ridge National Laboratory’s (ORNL) Manufacturing Demonstration Facility (MDF) worked with EOS Group to evaluate the current in-situ sensor capabilities of an EOS M290 Laser Powder Bed Fusion ...
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