Micron showed off a prototype of its 9650 Pro SSD, which uses a PCIe 6.0 x4 interface to deliver sequential reads and writes ...

Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...

China's 3nm chip; state of the industry supply chain; imec's next big push;; hyper-dimensional AI chip; OpenAI's $6.5B ...

Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...

The PS5 Pro includes a whopping 16 GB GDDR6 SDRAM plus 2 GB DDR5 SDRAM and 512 MB of DDR4 SDRAM. It is powered by Sony’s 3.85 ...

South Korean chipmaker SK hynix said Thursday it had developed a universal flash storage chip integrating the world’s highest ...

Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D ...

SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...

SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's ...

Phison Electronics (8299TT), a leading innovator of NAND controllers and NAND storage solutions, today announced a showcase ...