With self-developed chips Apple will reduce its dependence on third-party suppliers, thereby reducing component costs and ...

CEO Jensen Huang has had a month, as one would say. He provided more details on powerful new AI chips, such as Blackwell ...

The last time Barron’s convened a Tech Roundtable—in August 2023—generative artificial intelligence was in its honeymoon ...

Sian3: State-of-the-art 3nm DSP PHY delivers industry’s lowest power consumption with enhanced performance for 800G and 1.6T optical transceivers ...

For instance, Broadcom is developing the industry’s first 2-nanometer AI XPU with 3.5D packaging, targeting a performance of 10K teraflops. This represents a considerable leap in processing ...

Broadcom released security updates today to fix a high-severity authentication bypass vulnerability in VMware Tools for Windows. VMware Tools is a suite of drivers and utilities designed to ...

Broadcom strengthened its AI portfolio with the launch of the industry’s first Face-to-Face (F2F) 3.5D XPUs. 3.5D integration combines 3D silicon stacking with 2.5D packaging. Broadcom’s F2F ...

PALO ALTO, Calif. - Broadcom Inc. (NASDAQ:AVGO), a prominent player in the Semiconductors & Semiconductor Equipment industry with impressive gross profit margins, announced today significant ...

Broadcom was recently tipped off about an authentication bypass flaw in VMware Tools The 7.8 bug was quickly fixed, but no workarounds are available The bug affects Windows users, while Linux and ...