Abstract: We describe here Intel's 14nm high-performance logic technology interconnects and back end stack featuring 13 metal layers and a tri-metal laminated metal-insulator-metal (MIM) capacitor.
Abstract: This paper reports a novel dual-axis MEMS inertial sensor that utilizes multi-layered electroplated gold. All the MEMS structures are made by gold electroplating that is used as post-CMOS ...
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