Grand Canyon was an obvious mismatch for the University of Wyoming last weekend. The Antelopes came to Laramie with an average of 2.55 years of Division I experience, which ranks 11th nationally. The ...
Article subjects are automatically applied from the ACS Subject Taxonomy and describe the scientific concepts and themes of the article. Glass substrates have gained considerable attention as ...
Essemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly high speed solder paste jetting technology, now achieving 1.1 ...
What just happened? IP licensing company Adeia has sued AMD in the Western District of Texas, alleging that it used patented hybrid bonding methods in its stacked-cache processors without a license.
ABSTRACT: This study examined the factors influencing household decisions to engage in sustainable water conservation in a rural neighborhood confronting climate change and economic struggles. The ...
BBCube™: Bumpless Build Cube. A bumpless three-dimensional semiconductor integrating technology can address the challenges posed by traditional system-in-package (SiP) approaches. A novel power ...
For some people (e.g. this author) solder wick is a tool of last resort. Unfortunately, solder suckers and vacuum pumps lose most of their utility when you move from through-hole to SMD components, ...
Intel has revealed that it's experimenting with direct CPU water cooling, where an Intel CPU package has a waterblock built onto it to remove as much heat as possible from the chip. The company has ...
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