Lam Research Corp. has rolled out what it claims is an advanced plasma conductor etch tool needed for 3D chipmaking. Called ...

Applied’s new eBeam technology is critical for complex 3D architecture inflections required to manufacture logic chips at the ...

Infineon Technologies AG has made considerable progress on its 200mm SiC roadmap. The company will release the first products based on the advanced 200mm SiC technology to customers in Q1 2025. The ...

With this investment, Accretech further strengthens its position as a full-service solution provider in the semiconductor ...

Akara extends decades of Lam leadership in conductor etch. This includes multiple generations of the company's highly ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

The global silicon wafer industry is witnessing a resurgence, propelled by the escalating demand for advanced semiconductor ...

Lam competes with other major suppliers of wafer fabrication equipment, which are sophisticated and expensive tools to make ...