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The UK chip designer Alphawave has agreed to a $2.4bn (£1.8bn) takeover by Qualcomm. The deal is expected to be completed in ...
Researchers from Queen Mary University of London have unveiled a ground breaking biometric robotic hand, the F-TAC Hand.
China has offered US and European automotive car manufacturers a reprieve when it comes to the supply of rare earths.
How a systematic approach to embedded device software updating can help to meet EU security requirements. By George Grey ...
The ISO/SAE 21434 certification of the MICROSAR HSM firmware confirms the use of state-of-the-art processes in automotive ...
At the heart of the collaboration is the GW16159, an industrial-grade M.2 Wi-Fi HaLow card designed and manufactured by ...
ST introduces the STDRIVE102H and STDRIVE102BH, new integrated gate drivers for three-phase brushless motor control.
Sarcina Technology has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO).
GENESIS Project to develop more sustainable processes and technologies for the semiconductor-manufacturing industry.
GlobalFoundries to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities.
Even after three years of mass production, Samsung is said to be struggling to raise 3nm yields above 50 per cent.
Softbank and Intel are developing a new large-capacity memory that will reduce power consumption compared to HBM.
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