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Tom's Hardware on MSNSK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centersLeading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...
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Korea JoongAng Daily on MSNSK hynix develops new flash storage chip using 321-layer NANDSK hynix said Thursday it has developed a mobile universal flash storage (UFS) chip based on the world's highest 321-layer 1 ...
It will only be available in 512GB and 1TB capacities, which can cause problems down the line. Memory maker SK hynix has ...
Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...
According to and , SK Hynix System IC, the 8-inch foundry subsidiary of SK Hynix, is urging employees in both South Korea and ...
Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D ...
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South Korean chipmaker SK hynix said Thursday it had developed a universal flash storage chip integrating the world’s highest ...
A man suspected of attempting to smuggle SK hynix tech secrets to China was apprehended at South Korea’s Incheon ...
The company also demoed several ultra-low-latency setups, led by a 192GB (4×48GB) DDR5-6000 CL26 kit running on an MSI MAG ...
SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...
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