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SK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centers
Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...
SK Hynix unveils 321-layer UFS 4.1 that is faster, thinner and more efficient than the previous gen
It will only be available in 512GB and 1TB capacities, which can cause problems down the line. Memory maker SK hynix has ...
SK Hynix unveils UFS 4.1 solution with 321-layer NAND
SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...
DIGITIMES1d
SK Hynix develops UFS 4.1 solution based on 321-High NAND
SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's ...
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SK hynix stacks 321-layer NAND for AI boost
Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...
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Pain Relief With Linzagolix in UFs: PRIMROSE Trials
Pain reduction with linzagolix for uterine fibroids is partly explained by reduced heavy menstrual bleeding and fibroid ...
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Storage Meets AI: Longsys' Comprehensive Innovation Journey at COMPUTEX 2025
TAIPEI, May 21, 2025 /PRNewswire/ -- From May 20 to 23, COMPU TEX 2025 is held at Taipei Nangang Exhibition Center Halls 1 ...
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SK hynix announces the world's first 48GB 16-Hi HBM3E memory — Next-gen PCIe 6.0 SSDs and UFS 5.0 storage are also in the works
At the SK AI Summit 2024, SK hynix CEO took the stage and revealed the industry's first 16-Hi HBM3E memory - beating both Samsung and Micron to the punch. With the development of HBM4 going strong ...